By A. Fletcher
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Additional info for Advanced Organics for Electronic Substrates and Packages
PMMA is also used as a deep-UV resist but the long exposure time required makes it unsuitable for production situations and work is continuing on homopolymers and copolymers of methacrylate. The newer developments in X-ray resists have been centred on developing a high sensitivity, high resolution resist which is compatible with IC fabrication. PMMA and PBS are used for electron beam and X-ray resists but poly(2,3-dichloro-1-propyl acrylate) (DCPA) has been developed specifically for use as a negative X-ray resist.
All of these plastic packages are normally assembled by positioning in a mould with a phenolic based thermosetting compound to form the body. PLCC packages hold some 15% and SOPs some 6% of the market for IC packages. 2, which shows figures estimating current and future use by Siemens AG within the company, compared with figures estimating use within Europe and worldwide in the period pre-1989 to 1995. 2 44 54 2 63 27 10 Europe 25 71 2 World 18 74 8 World 45 40 19 SMT THT TAB Europe/World 58 53 34 29 8 18 Europe and Japan have adopted SMT at a faster rate than the USA.
One disadvantage of these programmes is that they have been developed for the injection moulding of thermoplastics rather than the thermosetting compounds commonly used in packaging. It is possible to develop analogues by selecting a thermoplastic material which approximates to the thermoset under investigation. Transfer moulds usually have multiple cavities and a standard mould for DIPs will have 360 cavities, although larger systems have been reported. Towa Precision Industry Ltd in Japan has developed a single mould with several resin pots served by a corresponding number of plungers to eliminate long runners and give shorter paths from pots to cavities.
Advanced Organics for Electronic Substrates and Packages by A. Fletcher